We are well equipped with state-of-the-art technologically advanced automated SMT manufacturing line to deliver Technology, Speed, and Reliability. Our manufacturing capability covers the wide spectrum of electronic manufacturing and diverse requirements of OEMs. We are flexible in volume, assembly, and processes to support today’s complexity in manufacturing. To know more about plant and equipment, please visit INFRASTRUCTURE page.
 
PCB assembly and Turnkey manufacturing are the core offerings from Vinrox. Our capability includes
 

• Through Hole PCB Assembly
• Surface Mount (SMT) PCB Assembly
• Mixed or Complex SMT and Through Hole PCB Assembly
• PBGA (Pitch Ball Grid Array), FBGA (Fine Ball Grid Array), Micro-BGA, CSP, Ultra-fine pitch QFP and QFN
• Thick/Thin Film
• Fine Pitch (0201 and 01005) components
• High-Mix and Low-Medium Volume
• Through Hole to SMT conversion
• Conformal Coating & Epoxy Potting
• Rapid Prototyping
• Box Build/Final assembly
• Turnkey Manufacturing
• Wire and Cable Harnessing
• Board Level or System Level Testing
• Lead-Free, RoHS Compliant, and Non-RoHS Process
• Online Quality Control